Copper-clad laminate is a basic material in the electronics industry, mainly used for the processing and manufacturing of printed circuit boards, with an average surface density of approximately 0.965 kg/m2; this dataset includes the main raw materials, auxiliary materials, energy, atmospheric emissions, and waste generated during the production process. The production equipment manufacturing, factory building construction, and other infrastructure are not included within the boundaries of the dataset; the data inventory is formed by merging data from multiple sources; the production of copper-clad laminate includes film production, lamination of film and copper foil, pressing, depaneling, cutting, and inspection.