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LCA dataset : Diamond wire, for silicon wafer cutting
General
Basic information
AI Translation
General
Basic information
Diamond wire, for silicon wafer cutting
diamond wire
Unit：m
Activity Type：
Production Mix
GWP100
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HiQLCD
Version
System model
Allocation, cut-off by classification (cutoff)
Substitution, Consequential(consequential)
Geography
Activity type
Consumption Mix
Production Mix
Reference product
diamond wire
HiQLCD
Version
System model
Allocation, cut-off by classification (cutoff)
Substitution, Consequential(consequential)
Geography
Activity type
Consumption Mix
Production Mix
Reference product
diamond wire
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