The average weight of the glass encapsulated diode is approximately 0.06g. This dataset includes primary raw materials, energy, atmospheric emissions, and waste from the production process. The production equipment manufacturing and plant construction infrastructure are not included within the scope of the dataset. The data inventory is aggregated from multiple sources. The production of glass encapsulated diodes involves processes such as etching, lead frame filling, mold clamping welding, acid washing and glass application, glass sintering, plastic sealing molding, molding and curing, electroplating, and inspection, etc.