This is a market dataset, representing the consumption market of the region. The dataset includes transport from the gate to the point of consumption, and transport services are calculated based on the transport situation of this product in the region. Electronic-grade silicon wafers are commonly used in the manufacturing of integrated circuits or chips, and the average areal density of the wafers is approximately 1774. 21g/m2; if you cannot specify the exact size of the wafer, you can use this dataset, which is the weighted average of the following: the \"wafer, 12-inches, for integrated circuits\" dataset and the \"wafer, 8-inches, for integrated circuits\" dataset. Specific technical details, scope boundary, etc., can be referred to in the production datasets of each wafer size. Infrastructure such as manufacturing equipment for production and plant construction are not included within the boundaries of the dataset. Raw materials, auxiliaries, energy, and various emissions involved in the wafer fabrication process are extrapolated based on the contract manufacturing production of 4-inch wafers; the wafer fabrication process includes the manufacturing process for polished wafers The manufacturing process and foundry steps of wafer fabrication include the production of polished wafers and foundry processing. The production of silicon polished wafers includes monocrystalline pulling processes, slicing and grinding processes, and polishing processes. The foundry processing includes main steps such as wafer cleaning, end diffusion, photolithography, oxidation, etching, thin film deposition, sintering, and metallization.