This is a market dataset, representing the consumption market of the region. The dataset includes transport from the gate to the point of consumption, and transport services are calculated based on the transport situation of this product in the region. The average weight of this glass encapsulated diode is approximately 0. 06g; This dataset includes primary raw materials, energy, atmospheric emissions, and waste from the production process. Manufacturing equipment, plant construction, and other infrastructures are not included within the boundaries of the dataset. The data inventory is compiled from multiple sources. The production of glass encapsulated diode includes etching, lead frame filling, mold welding, acid washing and glass dotting, glass sintering, plastic encapsulation molding, molding and curing, electroplating, and inspection.