Electronic-grade silicon wafers are commonly used in the manufacture of integrated circuits or chips, with the average surface density of these wafers being approximately 1774. 21g/m2; if you cannot determine the specific size of the wafer, you can use this dataset, which is the weighted average of the datasets for \"wafer, 12 inches, for integrated circuits\" and \"wafer, 8 inches, for integrated circuits\". For specific technical details, boundary scope, etc., refer to the production datasets of wafers of each size. Infrastructure such as production equipment manufacturing, and plant construction are not included within the dataset boundary. Raw and auxiliary materials, energy, and various emissions involved in the wafer foundry process are extrapolated from the foundry production of 4-inch wafers; the wafer manufacturing process includes polished wafer production Production and foundry processing steps: The manufacturing process of silicon wafers includes polished wafer production and foundry processing steps. The production of polished silicon wafers includes monocrystalline pulling, slicing and grinding, and polishing processes. Foundry processing includes wafer cleaning, end diffusion, lithography, oxidation, etching, thin film deposition, sintering, and metallization as the main processes.