Cradle to Gate
Identity ID
04949053-4a1c-41ae-9da5-aa895825ab18
Materials
Associated ID
eb02c291-0abc-470f-8464-aa9706782f96
Included activities starts
Included activities ends
Description
Electronic-grade silicon wafers are commonly used in integrated circuit or chip manufacturing, with a wafer diameter of 12 inches and an average surface density of approximately 1806. 37g/m2; this dataset includes major primary and auxiliary materials, energy, atmospheric emissions, and waste from the production process; infrastructure such as manufacturing of production equipment and construction of facilities is not included within the system boundary of the dataset; the life cycle inventory is compiled from data obtained from multiple sources; the data on raw and auxiliary materials, energy, and various emissions for the wafer foundry process are extrapolated and estimated based on 4-inch wafer foundry production; wafer manufacturing processes include polished wafer production and wafer contract processing steps; silicon polished wafer production includes monocrystalline pulling, slicing and grinding, and polishing; wafer contract processing includes wafer cleaning, end diffusion, photolithography, oxidation, and etching. , main processes such as thin film deposition, sintering, and metallization.
Activity Description
Wafer manufacturing processes include polished wafer production and wafer contract processing steps; silicon polished wafer production includes monocrystalline pulling, slicing and grinding, and polishing; wafer contract processing includes wafer cleaning, end diffusion, photolithography, oxidation, and etching. , main processes such as thin film deposition, sintering, and metallization.
Process Description
This product represents 1 m² of electronics-grade silicon wafer used in integrated circuit or chip manufacturing, for which the wafer product has completed all steps of the photomask process.
Time period
2019
2026
Geography
China
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology
Technology comment
Wafer manufacturing process includes polished wafer production and wafer contract processing steps; silicon polished wafer production includes monocrystalline pulling, slicing and grinding, and polishing; wafer contract processing includes wafer cleaning, end diffusion, photolithography, oxidation, and etching. , main processes such as thin film deposition, sintering, and metallization.