Cradle to Gate
Identity ID
061b8982-e175-4752-997d-2c9b88a3ca58
Materials
Associated ID
63c48960-67b6-4c6f-acb9-275c73f71f96
Included activities starts
Included activities ends
Description
Electronic-grade silicon wafers are commonly used in integrated circuit or chip manufacturing, with an average areal density of approximately 1774. 21g/m2; if you cannot specify the exact size of the wafer, you can use this dataset, which is a weighted average of the following: "Wafer, 12-inch, for integrated circuits" and "Wafer, 8-inch, for integrated circuits". For detailed technical specifications, system boundaries, and other descriptive information, please refer to the production datasets for wafers of respective sizes. Infrastructure such as manufacturing equipment and facility construction is not included within the system boundary of this dataset. Raw materials, auxiliary materials, energy consumption, and various emissions associated with the wafer foundry process are extrapolated from 4-inch wafer foundry production estimates. Wafer manufacturing processes include polishing wafer production. Production and wafer foundry steps; the wafer manufacturing process includes polished wafer production and wafer foundry steps. The production of silicon polished wafers includes monocrystalline pulling, slicing and grinding, and polishing; the wafer foundry process includes major steps such as wafer cleaning, end diffusion, photolithography, oxidation, etching, thin film deposition, sintering, and metallization.
Activity Description
Wafer manufacturing processes include polished wafer production and wafer foundry processing steps. The production of silicon polished wafers involves single crystal pulling, slicing and grinding, and polishing; the wafer foundry process includes major steps such as wafer cleaning, end diffusion, photolithography, oxidation, etching, thin film deposition, sintering, and metallization.
Process Description
This product represents 1 m² of electronics-grade silicon wafer used in integrated circuit or chip manufacturing, for which the wafer product has completed all steps of the photomask process.
Time period
2019
2026
Geography
China
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology