Cradle to Gate
Identity ID
2278490f-f820-4d76-8fe2-487938ba758a
Materials
Associated ID
1bed5c6b-940c-4440-bb2f-746b4c4499bc
Included activities starts
Included activities ends
Description
Copper clad laminate is a fundamental material in the electronics industry, primarily used for manufacturing printed circuit boards, with an average area density of approximately 0.965 kg/m2. This dataset includes major raw materials, energy inputs, atmospheric emissions, and waste from the production process; however, infrastructure such as production equipment manufacturing and facility construction are excluded from the system boundaries of this dataset. The life cycle inventory is compiled from data collected from multiple sources. The manufacturing process of copper clad laminate includes film production, combination of film and copper foil, pressing, depaneling, cutting, and inspection.
Activity Description
The production of copper-clad laminate includes processes such as resin impregnation, layering of prepreg and copper foil, pressing, debonding, cutting, and inspection.
Process Description
Copper-clad laminates are base materials for the electronics industry and are primarily used in the processing and manufacturing of printed circuit boards (PCB).
Time period
2021
2026
Geography
China
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology
Technology comment
The production of copper clad laminate includes processes such as resin impregnation, layering of prepreg and copper foil, pressing, debonding, cutting, and inspection.