Cradle to Gate
Identity ID
6697ebdf-6175-494c-a681-d5053837f77a
Materials
Associated ID
991b852d-ebf8-45e1-8169-9b0c5c324fa7
Included activities starts
Included activities ends
Description
Electronic-grade silicon wafers are commonly used in integrated circuit or chip manufacturing; the wafer has a diameter of 8 inches and an average surface density of 1687. 26 g/m²; this dataset includes major primary and auxiliary materials, energy, air emissions, and waste from the production process; infrastructure such as manufacturing of production equipment and facility construction is not included within the system boundary of the dataset; the life cycle inventory is compiled from multiple data sources, and the data on raw materials, energy, and various emissions from the wafer foundry process are extrapolated and estimated based on 4-inch wafer foundry production; the wafer manufacturing process includes polished wafer production and wafer outsourcing processing steps; the silicon polished wafer production includes monocrystalline pulling, slicing and grinding, and polishing processes; the wafer outsourcing processing includes wafer cleaning, end diffusion, photolithography, oxidation, and etching. , major processes such as thin film deposition, sintering, and metallization.
Activity Description
Wafer manufacturing processes include polished wafer production and wafer outsourcing processing steps; the silicon polished wafer production includes monocrystalline pulling, slicing and grinding, and polishing processes; the wafer outsourcing processing includes wafer cleaning, end diffusion, photolithography, oxidation, and etching. , major processes such as thin film deposition, sintering, and metallization.
Process Description
The product represents 1m² of electronic-grade silicon wafer used for integrated circuit or chip manufacturing. The wafer product has completed all steps of the photomask process.
Time period
2019
2026
Geography
China
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology
Technology comment
Wafer manufacturing process includes polished wafer production and wafer outsourcing processing steps; the silicon polished wafer production includes monocrystalline pulling, slicing and grinding, and polishing processes; the wafer outsourcing processing includes wafer cleaning, end diffusion, photolithography, oxidation, and etching. , major processes such as thin film deposition, sintering, and metallization.