LCA dataset : Copper clad laminate, epoxy resin based
Copper clad laminate, epoxy resin based
Copper Clad Laminate
Unit:m2Activity Type:Consumption Mix
GWP100
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HiQLCD
Version
System model
Geography
Activity type
Reference product
HiQLCD
Version
System model
Geography
Activity type
Reference product
System boundary
Cradle to Consumer
Identity ID
bba6099e-49c8-4d66-9226-8a126968fa0d
Dataset category
Materials
Associated ID
1bed5c6b-940c-4440-bb2f-746b4c4499bc
Included activities starts
The activity starts with the production and import of "Copper Clad Laminate" in this region.
Included activities ends
The activity ends with providing the "Copper Clad Laminate" to the consumers of this product. Transportation is included; however, product losses during transport are negligible and therefore not included.
Description
This is a market dataset representing the consumption market in the region. It includes transportation of the product from the factory gate to consumption, with transport services calculated according to the regional transportation conditions for the product.
Activity Description
The production of copper-clad laminate includes processes such as resin impregnation, layering of prepreg and copper foil, pressing, debonding, cutting, and inspection.
Process Description
Copper-clad laminates are base materials for the electronics industry and are primarily used in the processing and manufacturing of printed circuit boards (PCB).
Time period
2021
2026
Geography
China,Guangxi Zhuang Autonomous Region
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology
Technology comment
The production of copper clad laminate includes processes such as resin impregnation, layering of prepreg and copper foil, pressing, debonding, cutting, and inspection.