Cradle to Gate
Identity ID
e7a5e0d0-4b5d-4196-846d-8d39fdaea55d
Materials
Associated ID
9e2a052d-58bc-42ff-a9c1-822f8cfd7064
Included activities starts
Included activities ends
Description
The average weight of this glass encapsulated diode is approximately 0.06 g; this dataset includes major raw materials, auxiliary materials, energy inputs, atmospheric emissions, and waste generated during the production process, but infrastructure such as manufacturing of production equipment and facility construction is not included within the system boundary of the dataset; the life cycle inventory is compiled from data obtained from multiple sources; the production process of the glass encapsulated diode includes etching, lead frame insertion, die bonding, pickling and glass application, glass sintering, plastic encapsulation, curing, plating, and inspection procedures.
Activity Description
The production of glass-passivated diodes involves processes such as etching, lead frame insertion, die bonding, pick-and-place of glass, glass sintering, plastic encapsulation, curing, plating, and inspection.
Process Description
A diode consists of a semiconductor chip, a casing, and two electrodes. The packaging casing of a glass diode is made of glass material.
Time period
2017
2026
Geography
China
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology
Technology comment
The production of glass encapsulated diodes involves processes such as etching, lead frame insertion, die bonding, pick-and-place of glass, glass sintering, plastic encapsulation, curing, plating, and inspection.