Cradle to Gate
Identity ID
09849611-7eba-42f3-8595-a6a6eeaa8900
Materials
Associated ID
1563383a-99f5-4eff-82d2-b5dbed00be0e
Included activities starts
Included activities ends
Description
The average weight of this solid tantalum electrolytic capacitor is approximately 0.07 g; the dataset includes major primary and auxiliary materials, energy, atmospheric emissions, and waste from the production process, but infrastructure such as manufacturing equipment and facility construction is not included within the system boundary; the life cycle inventory is compiled from multiple data sources, with some data adjusted by referring to industry statistical data, standards, and emission factor manuals; the production of solid tantalum electrolytic capacitors includes processes such as powder mixing, pressing and forming, sintering, energization, dielectric coating, silver paste dipping, chip curing, molding and curing, edge trimming, aging, testing, and taping and warehousing.
Activity Description
The production of solid tantalum electrolytic capacitors includes processes such as powder mixing, pressing and forming, sintering, electroforming, coating, silver paste impregnation, chip assembly and curing, molding and curing, trimming, aging, testing, taping, and warehousing.
Process Description
Tantalum electrolytic capacitors use tantalum metal as the dielectric. A very thin layer of tantalum pentoxide is formed on the surface of the tantalum metal through an anodic oxidation process, serving as the dielectric. This oxide layer acts as the insulating medium and is integrally bonded with one end of the capacitor, forming one electrode, while the electrolyte serves as the cathode, thus constituting the capacitor.
Time period
2022
2026
Geography
China
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology
Technology comment
The production of solid tantalum electrolytic capacitors includes processes such as powder mixing, pressing and forming, sintering, energization, dielectric coating, silver paste dipping, chip curing, molding and curing, edge trimming, aging, testing, and taping and warehousing.