Cradle to Gate
Identity ID
a49f8ec7-ab68-43b9-8e60-a322dda4a8b2
Materials
Associated ID
bdc9cb71-a3a2-49ff-9f2f-f2401f41992c
Included activities starts
Included activities ends
Description
This product represents a bare 8-layer printed circuit board (PCB) with an area of 1 m², i.e., a PCB without electronic components, with an average areal density of approximately 5.785 kg/m². The dataset includes major raw and auxiliary materials, energy consumption, air emissions, and waste generated during the production process. Infrastructure such as manufacturing of production equipment and construction of facilities is excluded from the system boundary of this dataset. The life cycle inventory is compiled from data sourced from multiple references. PCB manufacturing involves several processes, including photomask fabrication, inner layer fabrication, copper deposition, outer circuit patterning, plating and etching, printing, surface treatment, shaping, and inspection.
Activity Description
PCB manufacturing involves several processes, including photomask fabrication, inner layer fabrication, copper deposition, outer circuit patterning, plating and etching, printing, surface treatment, shaping, and inspection.
Process Description
The product represents a bare 8-layer printed circuit board with an area of 1 m², i.e., the printed circuit board without electronic components, with an average areal density of approximately 5.785 kg/m².
Time period
2018
2026
Geography
China
Macroeconomic value
Business-as-Usual
Data validation
Yes
Technology
Current Technology
Technology comment
PCB manufacturing involves several processes, including photomask fabrication, inner layer fabrication, copper deposition, outer circuit patterning, plating and etching, printing, surface treatment, shaping, and inspection.